A cluster comprises a group of interconnected servers (aka nodes) across multiple racks, connected via Ethernet and increasingly via optical links, and is ideal for workloads that are so large and ...

Synopsys’ Greg Sorber finds that the next era of compute will be defined less by raw speed and more by architectural intelligence, the abstraction of hardware complexity, and the co-design of silicon, ...

Warpage is shifting from a global bow specification to a process-dependent surface-shape problem that affects bonding, alignment, lithography, reliability, and downstream assembly. Panel-level ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

Experts at the Table: Semiconductor Engineering sat down to discuss the opportunities and challenges of using AI in chip design, with Thomas Andersen, vice president for AI & Machine Learning at ...

The industry needs a common, implementation-level language for functional safety data—one that enables safety information to move through the development ecosystem with the same level of consistency ...

HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; ...

This research is significant in that it proposes a new design principle that allows the flow of light within photonic ...

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) ...