A new technical paper titled “FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates” was published by researchers at ETH Zurich. “Chiplet ...

Substrate-based packaging for chiplet designs is gaining favor among AI HPC customers, according to sources at OSATs. Some subscribers prefer to save their log-in information so they do not have to ...

With the reticle limit for chip manufacturing pretty much set in stone (pun intended) at 26 millimeters by 33 millimeters down to 2 nanometer transistor sizes with extreme ultraviolet lithography ...

While the Silicon 100 report was being compiled and curated to profile the most promising startups in the semiconductor industry in 2025, two prominent chiplet upstarts were already taken. First, ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...